Multilayer PCB with Immersion Gold Plating

Basic Info.

Model NO.	8P805I8665A
Base Material	Copper
Insulation Materials	Epoxy Resin
Model	PCB
Brand	Shengyi, Kb, Nanya, Ilm
Impedance	50/90/100 Ohm
Surfaec Treatment	Immersion Gold
Trace Width(Min.)	3mil
Criteria	Aql II 0.65
Bevel Edge	Yes
Hole Sizes	0.15mm/0.2mm
Transport Package	Vacuum Packaging
Specification	110*62mm
Trademark	XMANDA
Origin	Made in China
HS Code	8534001000
Production Capacity	50000sqm/Month

Product Description

Specifications:

Layers: 8Thickness: 4.0mmMaterial: FR4 S1000-2Size: 110*62mmSurface treatment: Immersion goldLine width/spacing: 3/3milMinimum aperture: 0.25mmSolder mask color: photosensitive greenFinished copper thickness: inner layer 1 OZ, outer layer 1 OZ

Features:

1. The integration of the board design is very high, the thickness-to-diameter ratio exceeds 10:1, and the difficulty of electroplating of copper is high.2. Made of TG170 materialShenzhen XMD Circuits Co.,Ltd, previously known as Jaleny(jlypcb), was founded in 2009 and started the journey of circuit board in Shenzhen,China. Through the introduction of advanced production and testing equipment and technical exchanges with factories in the same industry and engineering colleges, XMD greatly expanded the process capacity of double-sided board and multi-layer board. In 2011, we began to explore overseas markets and export foreign orders to all parts of the world. In 2018, Jiangxi Ji'an added a new production line, mainly making batch orders.

Able to produce 50,000 sqm of PCBs monthlyOne-stop solutions for clients (PCB & PCBA)Over 12 years of Experience in PCBsAvg Response time: ≤24 h (experienced Engineers to Serve you)Comply with RoHS,TS16949,ISO9001 and UL certifications.Flexibilities in Shipment Arrangement (FOB HK or Shenzhen by sea or by air, CIF via DHL,Fedex,UPS or TNT etc.)

A professional team, using automation, digitization to greatly improve pcb production efficiency and reduce PCB procurement costs.High-quality Raw Material★Traceable source of branded raw material★Standardized procurement process★Strict supplier selection policyProduction Equipment★High precision processing equipment★Efficient operation guarantees quality★Meet various special technical processesIntelligent System★Intelligent audition★Intelligent CAM★Intelligent paneling★Intelligent productionStrict Inspection★100% AOI testing★100% FQA/FQC★Quality Control★'Failed One Lost Ten'

Our Capabilities and Technology
Items		2022	2023
Layers		(MP):22layer,(Sampling):32 layer	(MP):32layer
Max. Board THK		Sampling 4.0mm / MP :3.2mm	Sampling 5.0mm / MP:3.2mm
Min. Board THK		Sampling :0.4mm /MP :0.5mm	Sampling: 0.3mm / MP:0.4mm
Base copper	Inner layer	1/3 ~ 6OZ	1/3~8 OZ
	Outer layer	1/3 ~ 6 OZ	1/3 ~ 8 OZ
Borehole diameter	Min.PTH	0.2mm	0.15mm
Max. aspect ratio		10:01	12:01
HDI aspect ratio		0.8:1	1:01
Tolerances	PTH	±0.076mm	±0.05mm
	NPTH	±0.05mm	±0.03mm
Solder mask opening		0.05mm	0.03mm
Solder dam		(Green) 0.076mm ,	(Green) 0.076mm ,
		(other color) 0.1mm	(other color) 0.08mm
Min. core THK.		0.1mm	0.08mm
Bow&twist		≤0.5%	≤0.5%
Routing Tol.		Sampling :±0.075mm /MP:±0.1mm	Sampling:±0.075mm /MP:±0.075mm
Impedance Tol.		±10%	±8%
Min. w/s (Inner layer)		0.075 / 0.075mm	0.075 / 0.075mm
Min. w/s (Outer layer)		0.075 / 0.075mm	0.075 / 0.075mm
(Min. BGA size)		0.2mm	0.15mm
(pitch)(Min. BGA Pitch)		0.65mm	0.5mm
(Working panel size)		600mm*700mm	600mm*700mm
Special process		Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole.