Silver Sintering Method PCB Board Alumina Ceramic Substrate with Metallization

Overview

Basic Info.

Model NO.	Customized
Trademark	JingHui
Origin	China
HS Code	8547100000

Product Description

Silver Sintering Method PCB Board Alumina Ceramic Substrate with MetallizationProduct Applications

With the development of third-generation semiconductor (including GaN, SiC, AlN, etc.) technology, power devices have begun to develop rapidly inthe fields of semiconductor lighting, power electronics, microwave radio frequency, 5G communication and new energy vehicles, and the demand forceramic substrates has surged.

Where are Ceramic Circuit Boards Mainly Used?Product Introduction

The silver firing method is to infiltrate a layer of metallic silver on the surface of the ceramic substrate. Silver has strong electrical conductivity andgood oxidation resistance. The fired silver layer is firmly bonded, the thermal expansion coefficient is close to that of the bare ceramic substrate, andthe thermal stability is good. In addition, the firing temperature is low, and the requirements on the atmosphere are not strict, and the firing processis simple and easy.The following is a schematic diagram of the Silver Firing Method of the ceramic substrate surface metallization process.How about Our Product Quality?Our products have been verified by the market for many years, their reliability and stability have been unanimously recognized by customers, andtheir quality has reached the leading level in the market.

Our Advantages

Jinghui has more than 10 years of experience in R&D and production of metallized ceramic substrates, and has proofing and mass productioncapabilities. We continuously promote the improvement and advancement of processes, facilities and equipment, actively seek new opportunities foradvanced material technologies, and assist customers in creating new operational value.