UL Immersion Gold FPCB Printed Circuit Board Enig PCB
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UL Immersion Gold FPCB Printed Circuit Board Enig PCB

UL Immersion Gold FPCB Printed Circuit Board Enig PCB

Package Size 60.00cm * 60.00cm * 50.00cm Package Gross Weight 1.500kg Top Quality Enig 12L PCB Board for Medical Electro
Basic Info.
Model NO. UC-32574
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Uc
Solder Mask Color Green/White/Black/Blue/Red
Material Finished Thickness 1.6mm
Certificate UL(Us&Canada). ISO9001. RoHS, Ts, SGS
Lead Time 7 Working Days
Base Material Type Fr4
Surface Treatment Immersion Gold/HASL Lead Free/OPS/ Immersion Silve
Board Layer 1-24 Layer
Transport Package Vacuum Package
Specification IPC class II
Trademark UC
Origin Shenzhen, China
HS Code 8534009000
Production Capacity 20000 Sqm/Month
Packaging & Delivery
Package Size 60.00cm * 60.00cm * 50.00cm Package Gross Weight 1.500kg
Product Description
Top Quality Enig 12L PCB Board for Medical Electronics Product Description
Layer:12 layerFinished Board thickness:1.6MMBoard material:FR-4Brand:KBTg aility:140 Finished Copper thickness:1 ozSurface treatment: Enigsolder mask Colour:GreenMin hole size:0.3mm We provide professional PCB manufacturing service. It will be our great pleasure to discuss with you about your PCB needs and requirements. Customer Satisfaction is Always Our First Priority!1.Products Application2. Market Distribution 3.Technical Capabilities
Max panel size32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz
Outer copper thickness0.5~6 oz
Finished board thickness0.4-3.2 mm

Board thickness tolerance control
±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation
Layer count Capability1-30 LAYER
alignment between ML±2mil
Min drilling0.15 mm
Min finished hole0.1 mm
Hole precision±2 mil(±50 um)
tolerance for Slot±3 mil(±75 um)
tolerance for PTH±3 mil(±75um)
tolerance for NPTH±2mil(±50um)
Max Aspect Ratio for PTH8:1
Hole wall copper thickness15-50um
Alignment of outer layers4mil/4mil
Min trace width/space for outer layer4mil/4mil
Tolerance of Etching+/-10%
Thickness of solder maskon trace0.4-1.2mil(10-30um)
at trace corner≥0.2mil(5um)
On base material≤+1.2mil Finished thickness
Hardness of solder mask6H
Alignment of solder mask film±2mil(+/-50um)
Min width of solder mask bridge4mil(100um)
Max hole with solder plug0.5mm
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger280u"(7um)
Max gold thickness for Gold finger30u"(0.75um)
Nickel thickness in Immersion Gold120u"/240u"(3um/6um)
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength≥61B/in(≥107g/mm)
bow and twist
4.Products Equipment
5.Our Certifications
We specilized in :
Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow production line, auto panel plating line, auto P.T.H Line, and other precision production equipments and AOI testing machine, flying probe tester machine and other advanced detection equipments.
Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
PCB assembly Equipment:
1. High speed and precision chip placer or multi-function SMD mounter
2. Wave soldering machine
3. Vacuum machine
4. High temperature box
5. Auto-solder paste printer
6. Hot- and mixed-air reflow
Requested informations for PCBA:
1. Components list
(a) Specification, brand, footprint
(b)To short the lead time, please kindly advise us if there is any acceptable components substitution.
(c) Schematic if necessary
2. PCB board information
(a) Gerber files
(b) PCB board processing technic
3. Testing Guide & Test Fixtures if necessary4. Programming files & Programming tool if necessary5. Package requirement
Why Choose Us?
1. Your inquiry related to our products or prices will be replied in 24hrs.2. Well-trained and experienced staffs to answer all your enquires in fluent English3. OEM&ODM, we can help you to design and put into product.4. Distributorship are offered for your unique design and some our current models5. Protection of your sales area, ideas of design and all your private information
Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.3. Sample can be delivered in 3days4. Shipping freight are quoted under your requests5. Shipping port: Shen zhen,Mainland China6. Discounts are offered based on order quantities7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.2. By DHL, UPS, FedEx, TNT3. By EMS (Usually for Russia Clients)4. By sea for mass quantity according to customer's requirement