0.5/1.0/1.5/2.0 Tc Al Ccl Aluminum Copper Clad Laminate Sheet for LED PCB

Basic Info.

Model NO.	AL base
Production Process	Additive Process
Base Material	Aluminum
Insulation Materials	Rcc
Brand	Hjh
Aluminum Base Material	1060 / 5052
Thermal Conductivity	0.6~2.0W
Breakdown Voltage	AC>/=5kv
Tg (DSC)	>130 Degree
Copper Thickness	15um, 18um, 25um, 35um, 70um, Others
Protective Film Color	Green
Sheet Thickness	0.6-2.0mm
Transport Package	Pallet
Specification	1000*1200MM, 500*600MM, others
Trademark	HJH
Origin	China
HS Code	7410211000
Production Capacity	200000 Sheets Per Month

Product Description

Aluminum Copper Clad Laminate Sheet
This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.
Properties
High mechanical strength and dimensional stability,
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting
Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.
Specifications
AL base materials: 1060, 5052Sheet Thickness: 0.6~2.0mmCopper thickness: 15um, 18um, 25um, 35um, 70um, othersUsual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mmThermal conductivity: 0.6W/m.K, 0.8W/m.K, 1.0W/m.K, 1.5W/m.K, 2.0W/m.KProtective film: blue film (80ºC), green film (160ºC)
Main Technical Characteristics

Items	Unit	Test condition	Typical values
			AF-01	AF-04	AF-05
Peel strength	N/mm	At normal: A	2.00	1.05	1.08
		After thermal stress	1.80	1.05	1.05
Surface resistance	MΩ	At normal	5.0 x 107	5.0 x 107	3.6 x 107
		Constant humidity treatment	2.0 x 106	4.5 x 106	3.3 x 106
Volume resistance	MΩ·m	At normal	4.0 x 108	1.0 x 108	4.2 x 108
		Constant humidity treatment	5.0 x 107	1.9 x 107	3.1 x 107
Thermal resistance	ºC/w	At normal	1.0	0.65	0.45
Dielectric Constant @ 1 MHz	--	40ºC, 93%, 96h	4.2	4.2	4.2
Dielectric dissipation factor @1 MHz	--	40ºC, 93%, 96h	0.02	0.029	0.033
Thermal stress	min	260ºC	2 min, no delamination, no air bulb
Dielectric breakdown	KV/MM	At normal	31	31	60
Flammability	--	At normal	FV-0
Thermal-conductive factor	W/m·k	At normal	1.0	1.5	2.2