UL Immersion Gold FPCB Printed Circuit Board Enig PCB
Package Size 60.00cm * 60.00cm * 50.00cm Package Gross Weight 1.500kg Top Quality Enig 12L PCB Board for Medical Electro
Basic Info.
Model NO. | UC-32574 |
Application | Consumer Electronics |
Flame Retardant Properties | V0 |
Mechanical Rigid | Rigid |
Processing Technology | Electrolytic Foil |
Base Material | Copper |
Insulation Materials | Organic Resin |
Brand | Uc |
Solder Mask Color | Green/White/Black/Blue/Red |
Material Finished Thickness | 1.6mm |
Certificate | UL(Us&Canada). ISO9001. RoHS, Ts, SGS |
Lead Time | 7 Working Days |
Base Material Type | Fr4 |
Surface Treatment | Immersion Gold/HASL Lead Free/OPS/ Immersion Silve |
Board Layer | 1-24 Layer |
Transport Package | Vacuum Package |
Specification | IPC class II |
Trademark | UC |
Origin | Shenzhen, China |
HS Code | 8534009000 |
Production Capacity | 20000 Sqm/Month |
Packaging & Delivery
Package Size 60.00cm * 60.00cm * 50.00cm Package Gross Weight 1.500kgProduct Description
Top Quality Enig 12L PCB Board for Medical Electronics Product DescriptionLayer:12 layerFinished Board thickness:1.6MMBoard material:FR-4Brand:KBTg aility:140 Finished Copper thickness:1 ozSurface treatment: Enigsolder mask Colour:GreenMin hole size:0.3mm We provide professional PCB manufacturing service. It will be our great pleasure to discuss with you about your PCB needs and requirements. Customer Satisfaction is Always Our First Priority!1.Products Application2. Market Distribution 3.Technical Capabilities
Items | Speci. | Remark | |
Max panel size | 32" x 20.5"(800mm x 520mm) | ||
Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
Inner copper thickness | 1~4 oz | ||
Outer copper thickness | 0.5~6 oz | ||
Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
±10% | ±10% | 6~8 L | |
±10% | ±10% | ≥10 L | |
Inner layer treatment | brown oxidation | ||
Layer count Capability | 1-30 LAYER | ||
alignment between ML | ±2mil | ||
Min drilling | 0.15 mm | ||
Min finished hole | 0.1 mm | ||
Hole precision | ±2 mil(±50 um) | ||
tolerance for Slot | ±3 mil(±75 um) | ||
tolerance for PTH | ±3 mil(±75um) | ||
tolerance for NPTH | ±2mil(±50um) | ||
Max Aspect Ratio for PTH | 8:1 | ||
Hole wall copper thickness | 15-50um | ||
Alignment of outer layers | 4mil/4mil | ||
Min trace width/space for outer layer | 4mil/4mil | ||
Tolerance of Etching | +/-10% | ||
Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
at trace corner | ≥0.2mil(5um) | ||
On base material | ≤+1.2mil Finished thickness | ||
Hardness of solder mask | 6H | ||
Alignment of solder mask film | ±2mil(+/-50um) | ||
Min width of solder mask bridge | 4mil(100um) | ||
Max hole with solder plug | 0.5mm | ||
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
Max Nickel thickness for Gold finger | 280u"(7um) | ||
Max gold thickness for Gold finger | 30u"(0.75um) | ||
Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
bow and twist | 0.75% |
5.Our Certifications
We specilized in :
Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow production line, auto panel plating line, auto P.T.H Line, and other precision production equipments and AOI testing machine, flying probe tester machine and other advanced detection equipments.
Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
PCB assembly Equipment:
1. High speed and precision chip placer or multi-function SMD mounter
2. Wave soldering machine
3. Vacuum machine
4. High temperature box
5. Auto-solder paste printer
6. Hot- and mixed-air reflow
Requested informations for PCBA:
1. Components list
(a) Specification, brand, footprint
(b)To short the lead time, please kindly advise us if there is any acceptable components substitution.
(c) Schematic if necessary
2. PCB board information
(a) Gerber files
(b) PCB board processing technic
3. Testing Guide & Test Fixtures if necessary4. Programming files & Programming tool if necessary5. Package requirement
Why Choose Us?
1. Your inquiry related to our products or prices will be replied in 24hrs.2. Well-trained and experienced staffs to answer all your enquires in fluent English3. OEM&ODM, we can help you to design and put into product.4. Distributorship are offered for your unique design and some our current models5. Protection of your sales area, ideas of design and all your private information
Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.3. Sample can be delivered in 3days4. Shipping freight are quoted under your requests5. Shipping port: Shen zhen,Mainland China6. Discounts are offered based on order quantities7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.2. By DHL, UPS, FedEx, TNT3. By EMS (Usually for Russia Clients)4. By sea for mass quantity according to customer's requirement
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